We work with top pcb laminate providers to bring you a wide range of material options such as enhanced epoxy laminates ultra low moisture materials high frequency ceramic filled laminates ul 94v 0 rated rohs compliant and more.
High temperature pcb laminate.
Medium tg pcbs generally have a maximum temperature of above 150 c while high tg pcbs are rated above 170 c.
For pcbs the tg corresponds to the temperature at which fiberglass becomes amorphous during lamination at high temperatures and under pressure of the different material layers.
High temperature laminates should have the following protective properties.
After thermal stress at high temperatures and after chemical exposure.
Medium high tg pcb.
Advanced printed circuit board laminate materials.
High temperature pcb laminates can prevent overheating by offering heat protection for the pcb s components.
It is not the pcb maximum operating temperature but rather that which the pcba can endure for a short time before it deteriorates.
Glass transition temperature tg.
During the pcb manufacturing stage peel strength is tested on one ounce thick copper traces under the following three conditions.
Glass transition temperature refers to the temperature at which polymers shift thermodynamically from rigid to soft.
List of some common pcb laminates and their typical thermal conductivity values.
If an application demands pcb with higher tg value you ll need to opt for a medium or high tg pcbs.
Our laminate and prepreg materials are used in a variety of advanced electronics including network and communications equipment and high end consumer electronics as well as advanced automotive aerospace military and medical applications.
Beyond typical fr4 maximum temperature.
We have a 99 plus customer satisfaction rate and are well known for our reliable fast service as shown by our customer testimonials.
At pcbcart our high temperature pcb products can handle extreme pcb glass transition temperature rates and retain their integrity so you can use these high tg fr 4 boards with confidence.
The bonding ability between dielectric and copper layers in a printed circuit board is known as peel strength.
There have been circuit applications which were not high frequency but still used one of these laminates because of the improved thermal conductivity.
General fr4 tg is 130 140 centigrade moderate tg is greater than 150 160 centigrade high tg is greater than 170 degrees.
Ordinary pcb materials at high temperatures not only will be softened deformation melting and other phenomena but also the mechanical and electrical properties decline sharply.
The last three materials on the list are generally used in high frequency pcb applications.
If you are going to use your printed circuit boards in high temperature situations pcb laminates for high temperature are a requirement.